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MATERIAL AND PLATING
PRODUCT FEATURES
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DOWNLOAD 73 PAGE MIL/AERO CATALOG |
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MATERIAL AND PLATING
DOWNLOAD 73 PAGE MIL/AERO CATALOG |
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MATERIAL AND PLATING
DOWNLOAD 73 PAGE MIL/AERO CATALOG |
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ADVANTAGES OF FILTER CONNECTORSThe integration of the filter elements into the connector, rather than a board-level solution, results in many advantages to the user:
DOWNLOAD 73 PAGE MIL/AERO CATALOG |
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ADVANTAGES OF FILTER CONNECTORSThe integration of the filter elements into the connector, rather than a board-level solution, results in many advantages to the user:
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The Amphenol microminiature contact system employs a precision stamped and formed pin contact recessed within the plug insulator. The socket contact is a precision fabricated tube. Pin and socket contacts are epoxy retained in high-grade thermoplastic insulators. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513. Terminations are available in a broad range including solder cup, terminated to wire harness, vertical and right angle PCB. Plastic and metal shell versions are available, in a broad range of shell finishes. A broad range of mounting hardware is available (jackscrews, posts, guide pins) as well as straight and angled back-shells. |
FEATURES AND BENEFITS
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FEATURE & BENEFITS
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| PERFORMANCE SPECIFICATIONS | |
| Service Temperature Range: | -55°C to +125°C |
| Termination Style: | Crimp discrete wires, cable / ribbon assemblies, PC tail |
| Insulation Resistance: | 5000 Meg-ohms min. |
| Contact Resistance: | < 26 milliOhms |
| Mechanical Shock and Vibration: | >50 G / >20 G (10 – 2000 Hz) Peak Acceleration |
| Mating & Mounting: | Board to Board, Board to Wire, Wire to Wire, Front & Rear Panel Mount |
| MATERIAL SPECIFICATIONS | |
| Shell Material: | Aluminum alloy or high-performance polymer |
| Insert Material: | PPS (Ryton) per Mil-M-24519 |
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For Sea, Air or Land, these connectors are SEALED! Amphenol’s SD308 Sealed D-Subminiature and Press Fit (C308 Series) Connectors are available in the full range of standard density and hi-density insert arrangements, pin and socket contacts. These connectors are supplied with fixed screw machine contacts and are available in Solder Cup, Straight PCB, Right Angle PCB. |
FEATURES AND BENEFITS
APPLICATIONS
DOWNLOAD SD308/C308 DATASHEET |
| PERFORMANCE SPECIFICATIONS | |
| Dielectric withstanding voltage (DWV): | 1,000 vac pin to pin, pin to shell |
| Current Rating: | 5A |
| Insulation Resistance: | 5 Gigohm @ 500 VDC |
| Working Voltage: | 120 vac |
| Operating Temperature: | -67°F to +257°F (-55°C to +125°C) |
| MATERIAL SPECIFICATIONS: | |
| Shells: | Machined Aluminum alloy, tin plated |
| Inserts: | High-temperature resistant Polyethersulfone per MIL-P-46185 |
| Contacts: | Copper alloy, 20µ" (0.51µM) gold plated over nickel |
| Seal: | Conductive silicone elastomer with nickel plated graphite flake |
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The Amphenol Micro-D connector series (M83513) offers proven military spec performance and reliability in rectangular and stripline micro connectors. The Micro-D connectors are available in rectangular D, strip and custom card edge configurations, with contacts on .050 (1.27) centers. Inserts in Micro-D miniature connectors with signal and coax/power contacts are also available. The socket contact is a precision fabricated tube. Pin and socket contacts are epoxy retained in high-grade thermoplastic insulators. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513. Terminations are available in a broad range including solder cup, terminated to wire harness, vertical and right angle PCB. Plastic and metal shell versions are available in Micro-D series, in a broad range of shell finishes. A broad range of mounting hardware is available (jackscrews, posts, guide pins) as well as straight and angled back-shell. HI-DENSITY CARD CONNECTORDesigned for a space-conscious industry. Provides an extremely dense and reliable interconnection for card-to-card and card-to-cable applications. Connector performance per M83513 specifications. Available in vertical mount for thru-hole applications and wire harness termination styles for both plug and receptacle.Wide selection of wire sizes (24 thru 30). Shell employs a polarizing "D" shape for correct mating. |
FEATURES AND BENEFITS
MICRO-MINIATURE CONTACT SYSTEMThe Micro-miniature contact system employs a precision stamped and formed pin contact recessed within the plug insulator. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513. MICRO-D STRIP CONNECTOROne piece insulator: Polyphenylene sulfide (Ryton) Contacts (1-30 positions): Copper alloy, gold plate Guide pin (optional, one or both ends): 300 series stainless steel Wide selection of wire sizes, types, and color finish. Coupling feature: Friction Contact spacing: .050" (1.27) centres MICRO-D CONNECTOR SAVER
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| PERFORMANCE SPECIFICATIONS Micro-D | ||
| Contact Rating: | 3 amps max. | |
| Magnetic Permeability: | ASTM-A342/A342M | 2.0 µ max. |
| Dielectric Withstanding Voltage (DWV) : Test voltage rms 60Hz ac volts |
EIA-364-20 | At sea level: 600 vac for solder pot and standard wire at 70,000 ft altitude (reduced barometric pressure): 150 vac for solder pot and standard wire |
| Insulation Resistance: | EIA-364-21 | 5000 megohms min. |
| Contact Resistance: | EIA-364-23 | 8 milliohms at 3 amps |
| Contact Engagement Force: | MIL-DTL-83513 | 6.0 oz. max. |
| Contact Separation Force: | MIL-DTL-83513 | 0.5 oz. min. |
| Connector Mating Force: | MIL-DTL-83513 | (10 oz. times no. of contacts) max. |
| Connector Unmating Force: | MIL-DTL-83513 | (0.5 oz. times no. of contacts) min. |
| Thermal Shock (Temperature Cycling): | EIA-364-32, condition I, 5 cycles | No physical damage -55°C to +125°C (-67°F to +257°F) |
| Mechanical Shock (Specified Pulse): | EIA-364-27, condition E | No physical damage and no loosening of parts, No loss of continuity > 1 microsec. |
| Vibration: | EIA-364-28, condition IV | No physical damage and no loosening of parts, No loss of continuity > 1 microsec. |
| Durability: | MIL-DTL-83513 | 500 mating cycles at a rate of 200 ±100 CPH |
| Salt Spray (Corrosion): | EIA-364-26, condition B | Meets mateability and contact resistance requirements |
| Fluid Immersion: | MIL-DTL-83513 | Meets mateability requirements |
| Humidity: | EIA-364-31 | Meets D.W.V. and insulation resistance requirements 1 megohm nim. after step 6, 1000 megohms min. after 24 hrs. of conditioning |
| Insert Retention (class M): | MIL-DTL-83513 | 50 lbs. min. (axial load) |
| Solderability: | MIL-STD-202, method 208 | Withstand test conditions |
| Contact Retention E: | IA-364-29 | 5 lbs. min. (axial load) |
| Thermal Vacuum Outgassing (Space Classes): | SP-R-0022 or ASTM E595 | Exceeds MIL-DTL-83513 requirements; standard is 1.0% max TML and 0.1% max VCM or original mass |
| MATERIAL SPECIFICATIONS Micro-D | ||
| Shell Material: | Std. Metal (100, 106, 110 & M13 Series) | Aluminum alloy 6061-T6 per QQ-A-200/8 |
| 104 Series | Stainless Steel | |
| Std. Plastic (101, 102 & 105 Series) | Polyphenylene sulfide (Ryton) | |
| High Temp Plastic | High-performance thermoplastic (PEEK or equivalent) | |
| Shell Finish (Metal Shells only): | Anodized, Cadmium, Gold, Irridite/Alodine Electroless Nickel, Tin | |
| Insulator/PCB Backshell: | Polyphenylene sulfide (Ryton) per MIL-M-24519, type GST-40F; color: Black | |
| Contacts: | Copper alloy, 50 micro-inches gold plate over nickel | |
| Hardware: | Stainless Steel, Passivated | |
| Potting Material: | Std. Epoxy | EP1730-1 or equivalent; color: Black |
| High Temp Epoxy | EP173859 or equivalent | |